Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis.
Joseph FavataSina ShahbazmohamadiPublished in: Microelectron. Reliab. (2018)
Keyphrases
- integrated circuit
- reverse engineering
- x ray
- finite element analysis
- computer aided design
- electron microscope
- electron beam
- finite element
- software engineering
- image reconstruction
- discrete tomography
- object oriented
- x ray images
- digital x ray images
- filtered back projection
- intraoperative
- tomographic images
- using artificial neural networks
- finite element model
- three dimensional
- projection images
- stress distribution
- tomographic reconstruction
- artificial intelligence
- metal oxide
- transmission electron microscopy
- databases
- database
- low cost
- multi view
- computer aided
- noise level