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SiC power devices packaging with a short-circuit failure mode capability.

Ilyas DcharCyril ButtayHervé Morel
Published in: Microelectron. Reliab. (2017)
Keyphrases
  • short circuit
  • failure modes
  • thin film
  • high density
  • power consumption
  • mobile devices
  • high speed
  • power dissipation
  • power distribution
  • artificial intelligence
  • embedded systems
  • fault tree