Mechanical and electrical reliability of copper interconnections for 3DIC.

Naoki Saito Naokazu Murata Kinji Tamakawa Ken Suzuki Hideo Miura

Published in: 3DIC (2011)

Keyphrases

printed circuit boards
electro mechanical
electrical power
visual inspection
high density
thin film
power system
transmission line
integrated circuit
mechanical design
databases
information retrieval
experimental data
reliability analysis
low voltage