High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures.
Wenke WeinreichMatthias RudolphJohannes KochJan PaulKonrad SeidelStefan RiedelJonas SundqvistKatja SteidelManuela GutschVolkhard BeyerChristoph HohlePublished in: ICICDT (2013)