Passive and wireless strain sensor based on LC circuit with lamination fabrication.
Cheng TuChin-Liang LiuMeng-Shiue LeeWensyang HsuPublished in: NEMS (2017)
Keyphrases
- high speed
- semiconductor devices
- wireless networks
- wireless communication
- integrated circuit
- mobile devices
- electronic circuits
- high density
- analog circuits
- circuit design
- thin film transistor
- communication technologies
- electron beam
- portable devices
- mobile networks
- mobile communication
- quasi static
- mobile ad hoc networks
- frequency response
- access points
- silicon on insulator
- digital circuits
- wifi
- sensor data
- finite element analysis
- cellular networks
- wireless lan
- multi hop
- mobile computing
- wireless local area networks
- computer simulation
- wireless sensor networks