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Modelling and electro-hygrothermo-mechanical reliability analyses of leadless dual IC packages.
K. Balaguru
K. Padmanabhan
S. Subeesh
Published in:
Int. J. Comput. Aided Eng. Technol. (2014)
Keyphrases
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integrated circuit
software packages
reliability analysis
neural network
primal dual
computer vision
clustering algorithm
statistical tests
comparative analysis
failure rate
database
real time
real world
linear programming
statistical analysis
mechanical design