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Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder.
YoungBae Kim
Hiroshi Noguchi
Masazumi Amagai
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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failure rate
mechanical properties
printed circuit boards
high temperature
integrated circuit
database
decision making
similarity measure
artificial neural networks
software package
highly reliable
reliability analysis
semiconductor devices
stress response