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3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing.
Shu Yuan
Dongping Tian
Yanxing Zeng
Published in:
IEICE Trans. Electron. (2006)
Keyphrases
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integrated circuit
printed circuit boards
video sequences
hamming distance
electron beam
multi class
low cost
parallel algorithm
message passing
quality control
non binary
manufacturing process
long period
hardware description language