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Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections.

A. VandoorenN. PariharJacopo FrancoRoger LooH. ArimuraR. RodriguezF. SebaaiS. IacovoKevin VandersmissenW. LiG. MannaertD. RadisicE. RosseelAndriy HikavyyA. JourdainO. MoureyG. GaudinS. RebohL. Le Van-JodinG. BesnardC. Roda NeveB.-Y. NguyenI. RaduE. Dentoni LittaN. Horiguchi
Published in: VLSI Technology and Circuits (2022)
Keyphrases
  • silicon on insulator
  • high density
  • high speed
  • multi layer
  • real time
  • neural network
  • artificial neural networks
  • low cost
  • coding scheme
  • power supply
  • cmos technology