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23.4 A 56Gb/s 300mW silicon-photonics transmitter in 3D-integrated PIC25G and 55nm BiCMOS technologies.
Enrico Temporiti
Gabriele Minoia
Matteo Repossi
Daniele Baldi
Andrea Ghilioni
Francesco Svelto
Published in:
ISSCC (2016)
Keyphrases
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power supply
high speed
transmission electron microscopy
high density
cmos technology
power consumption
data mining
silicon on insulator
neural network
metal oxide semiconductor
hd video
space charge
high definition
emerging technologies
communication systems
signal to noise ratio
x ray
computational intelligence