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Incorporating Multi-Chip Module Packaging Constraints into System Design.

Vivek GargSteve LacyDavid E. SchimmelDarrell StognerCraig D. UlmerD. Scott WillsSudhakar Yalamanchili
Published in: ED&TC (1996)
Keyphrases
  • design process
  • high speed
  • single chip
  • constrained optimization
  • database
  • low cost
  • case study
  • design methodology
  • real time
  • operating system
  • high density
  • linear constraints
  • modular design
  • analog vlsi
  • phase locked loop