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High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing.

Toshiaki ItabashiMasashi KotaniMelvin P. ZussmanK. ZoschkeT. FischerM. TopperHiroyuki Ishida
Published in: 3DIC (2011)
Keyphrases
  • high temperature
  • manufacturing process
  • integrated circuit
  • database
  • neural network
  • optimal solution
  • quality control
  • massively parallel
  • process planning
  • business goals