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Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.
Yanan Tao
Chao Liang
Ziqi Mei
Zhiqiang Song
Yu Wu
Yunna Sun
Wenqiang Zhang
Yong Ruan
Xiaoguang Zhao
Published in:
Microelectron. J. (2024)
Keyphrases
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numerical simulations
semiconductor devices
theoretical analysis
thin film
high density
simulation data
finite element method
computational fluid dynamics
numerical calculation
electron beam
lattice boltzmann
temperature field