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A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component.

Sanguk LeeHyunwoong KimJangyong AhnJaewon RheeJaeyong ChoHongseok KimSeungyoung Ahn
Published in: IEEE Trans. Instrum. Meas. (2024)
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