60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules.
Satoshi YoshidaShoichi TanifujiSuguru KamedaNoriharu SuematsuTadashi TakagiKazuo TsubouchiPublished in: IEICE Trans. Electron. (2012)
Keyphrases
- frequency band
- wire bonding
- dual band
- multichip module
- dielectric constant
- image reconstruction
- back end
- high frequency
- building blocks
- software package
- stress response
- modular structure
- low frequency
- high density
- electric field
- thin film
- multi band
- functional modules
- modular architecture
- subband
- high speed
- database
- power distribution
- patch antenna
- database systems
- neural network
- real time