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Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist.

Fang ZhongTao DongHe YongSu Yan
Published in: BMEI (2012)
Keyphrases
  • thin film
  • electron microscopy
  • high density
  • grain size
  • x ray
  • single image
  • multi layer
  • solar cell
  • data mining
  • feed forward
  • short circuit