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Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC.
Menglin Tsai
Amy Klooz
Alexander Leonard
Jennie Appel
Paul D. Franzon
Published in:
3DIC (2009)
Keyphrases
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high speed
low cost
integrated circuit
real time
case study
defect detection
gallium arsenide
data sets
cmos technology