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8Gb 3D DDR3 DRAM using through-silicon-via technology.

Uksong KangHoeju ChungSeongmoo HeoSoon-Hong AhnHoon LeeSooho ChaJaesung AhnDukmin KwonJin Ho KimJaewook LeeHan-Sung JooWoo-Seop KimHyun-Kyung KimEun-Mi LeeSo-Ra KimKeum-Hee MaDong-Hyun JangNam-Seog KimMan-Sik ChoiSae-Jang OhJung-Bae LeeTae-Kyung JungJei-Hwan YooChanghyun Kim
Published in: ISSCC (2009)
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