High density and reliable packaging technology with Non Conductive Film for 3D/TSV.
Kentaro MoriYoshihiro OnoShinji WatanabeToshikazu IshikawaMichiaki SugiyamaSatoshi ImasuToshihiko OchiaiRyo MoriTsuyoshi KidaTomoaki HashimotoHideki TanakaMichitaka KimuraPublished in: 3DIC (2013)