Thermal and power delivery considerations of the 65k pixel 3-D integrated radiation imaging module with through-silicon vias.
Krzysztof KasinskiPublished in: MIXDES (2017)
Keyphrases
- infrared
- liquid crystal
- focal plane
- high density
- thermal infrared
- small animal
- charge coupled device
- imaging systems
- photon counting
- x ray
- visible spectrum
- image processing
- high resolution
- ccd camera
- power consumption
- integrated circuit
- low cost
- three dimensional
- electrical power
- image sensor
- high speed
- input image
- silicon dioxide
- computer vision
- radiation doses
- low dose
- clinical applications
- thin film
- data center
- medical imaging
- image analysis