Login / Signup
Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test.
Yoshihiko Kanda
Yoshiharu Kariya
Published in:
Microelectron. Reliab. (2012)
Keyphrases
</>
mechanical properties
high temperature
electron microscopy
desirable properties
data sets
database
evaluation method
pattern generator
real time
neural network
genetic algorithm
test data
early stage
evaluation criteria
evaluation methods