Research on the Cooling System for the System-on-Wafer Packaging.

Rong Cao Guandong Liu Jie Li Weihao Wang Chuanzhi Wang Lingling Liu Yuanxing Duan

Published in: NEMS (2023)

Keyphrases

semiconductor manufacturing
integrated circuit
high density
high speed
simulated annealing
heat transfer
massively parallel
databases
design process
high quality
manufacturing process
real time
special case
computational complexity
objective function
machine learning
wire bonding