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Prospects for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects.

Hiren D. ThackerJames D. Meindl
Published in: ITC (2006)
Keyphrases
  • input output
  • integrated circuit
  • high speed
  • printed circuit boards
  • fiber optic
  • levels of abstraction
  • data sets
  • higher level
  • test cases
  • high density
  • storage systems