Login / Signup

Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages.

Po-Yao ChuangFrancesco LorenzelliSreejit ChakravartyCheng-Wen WuGeorges G. E. GielenErik Jan Marinissen
Published in: VTS (2023)
Keyphrases
  • cost effective
  • artificial intelligence
  • computationally efficient
  • input output
  • lower cost
  • databases
  • training data
  • objective function
  • video sequences
  • multiresolution
  • low cost
  • intra class