An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly.
Tsung-Nan TsaiPublished in: Int. J. Comput. Integr. Manuf. (2013)
Keyphrases
- quality assessment
- process control
- integrated circuit
- printed circuit boards
- stress response
- wire bonding
- manufacturing process
- control system
- bond pad
- image quality
- product quality
- human visual system
- video quality
- data quality
- electron beam
- image quality assessment
- quality metrics
- databases
- hardware description language
- high speed
- perceptual image quality
- image retrieval
- high quality