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QoS 3D-HoC hybrid-on-chip communication structure for dynamic 3D-MPSoCs.

Johanna SepúlvedaGuy GogniatRicardo PiresCésar PedrazaWang Jiang ChauMarius Strum
Published in: LASCAS (2013)
Keyphrases
  • high speed
  • low cost
  • information sharing
  • multimedia communication
  • quality of service
  • neural network
  • hierarchical structure
  • physical design
  • communication services
  • high density
  • dynamic behavior
  • vlsi implementation