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A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs.

Dong XiangKele Shen
Published in: ACM J. Emerg. Technol. Comput. Syst. (2014)
Keyphrases
  • three dimensional
  • test cases
  • d objects
  • data driven
  • test suite
  • database
  • real time
  • decision support
  • infrared
  • usability testing
  • integration testing