Stress-driven 3D-IC placement with TSV keep-out zone and regularity study.
Krit AthikulwongseAshutosh ChakrabortyJae-Seok YangDavid Z. PanSung Kyu LimPublished in: ICCAD (2010)
Keyphrases
- machine learning
- image sequences
- study proposes
- data sets
- integrated circuit
- quantitative and qualitative
- theoretical framework
- experimental study
- statistical analysis
- probability distribution
- hidden markov models
- artificial neural networks
- data structure
- clustering algorithm
- knowledge base
- feature selection
- information systems
- computer vision
- social networks
- artificial intelligence