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Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling.
Xiaonan Guan
Kun Xi
Zhihui Xie
Jian Zhang
Zhuoqun Lu
Yanlin Ge
Published in:
Microelectron. J. (2023)
Keyphrases
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infrared
low cost
high density
high speed
global optimization
solder ball connect
optimization problems
optimization algorithm
thermal imaging
electrical properties
thermal images
optimization method
power plant
optimization process
neural network
random variables
probability distribution