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Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost.

Mottaqiallah TaouilSaid HamdiouiKees BeenakkerErik Jan Marinissen
Published in: J. Electron. Test. (2012)
Keyphrases
  • integrated circuit
  • cost benefit
  • data sets
  • case study
  • total cost
  • statistical significance
  • testing process
  • social networks
  • multiscale
  • test data
  • massively parallel
  • high cost
  • software testing
  • cost reduction