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Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding.
Akihiro Ikeda
L. J. Qiu
K. Nakahara
Tanemasa Asano
Published in:
3DIC (2013)
Keyphrases
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mechanical properties
electron microscopy
room temperature
case study
multiscale
finite element model
image segmentation
three dimensional
light source
surface model