Solder void detection of bottom terminated components on printed circuit board for low-resolution x-ray images.
Arda GuneyMurat BayraktarMuhammet OzcanPublished in: SIU (2018)
Keyphrases
- printed circuit boards
- low resolution
- x ray images
- high resolution
- super resolution
- x ray
- fracture detection
- low resolution images
- visual inspection
- medical images
- integrated circuit
- high resolution images
- high quality
- higher resolution
- lower resolution
- image super resolution
- single view
- face images
- depth map
- super resolution reconstruction
- active appearance models
- manufacturing process
- assembly process
- remote sensing
- face recognition
- multi view
- low quality images