Yongping Lei

Publication Activity (10 Years)

Years Active: 2010-2018
Publications (10 Years): 1

Top Topics

Genetic Algorithm

Solder Ball Connect

Top Venues

Microelectron. Reliab.

Publications

Jian Gu, Jian Lin, Yongping Lei, Hanguang Fu
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling. Microelectron. Reliab. 80 (2018)
Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. Microelectron. Reliab. 50 (12) (2010)