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Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling.

Jian GuJian LinYongping LeiHanguang Fu
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • probabilistic model
  • machine learning
  • decision trees
  • electron microscopy
  • data sets
  • expert systems
  • complex systems
  • genetic algorithm
  • learning algorithm
  • social networks
  • higher level
  • solder ball connect