Login / Signup

Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.

Yaowu ShiYanfu YanJianping LiuZhidong XiaYongping LeiFu GuoXiaoyan Li
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • mechanical properties
  • material properties
  • finite element
  • finite element model
  • data sets
  • artificial intelligence
  • multiresolution
  • boundary conditions
  • modeling method
  • physiological processes