TJ Dai

Publication Activity (10 Years)

Years Active: 2023-2023
Publications (10 Years): 2

Top Topics

Integrated Circuit

Semiconductor Manufacturing

Top Venues

IEEE J. Solid State Circuits

Publications

Menghan Guo, Shoushun Chen, Zhe Gao, Wenlei Yang, Peter Bartkovjak, Qing Qin, Xiaoqin Hu, Dahai Zhou, Qiping Huang, Masayuki Uchiyama, Yoshiharu Kudo, Shimpei Fukuoka, Chengcheng Xu, Hiroaki Ebihara, Xueqing Wang, Peiwen Jiang, Bo Jiang, Bo Mu, Huan Chen, Jason Yang, TJ Dai, Andreas Suess
A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function. IEEE J. Solid State Circuits 58 (11) (2023)
Menghan Guo, Shoushun Chen, Zhe Gao, Wenlei Yang, Peter Bartkovjak, Qing Qin, Xiaoqin Hu, Dahei Zhou, Masayuki Uchiyama, Shimpei Fukuoka, Chengcheng Xu, Hiroaki Ebihara, Andy Wang, Peiwen Jiang, Bo Jiang, Bo Mu, Huan Chen, Jason Yang, TJ Dai, Andreas Suess, Yoshiharu Kudo
A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function. ISSCC (2023)