A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1-MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function.
Menghan GuoShoushun ChenZhe GaoWenlei YangPeter BartkovjakQing QinXiaoqin HuDahai ZhouQiping HuangMasayuki UchiyamaYoshiharu KudoShimpei FukuokaChengcheng XuHiroaki EbiharaXueqing WangPeiwen JiangBo JiangBo MuHuan ChenJason YangTJ DaiAndreas SuessPublished in: IEEE J. Solid State Circuits (2023)