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A 3-Wafer-Stacked Hybrid 15MPixel CIS + 1 MPixel EVS with 4.6GEvent/s Readout, In-Pixel TDC and On-Chip ISP and ESP Function.

Menghan GuoShoushun ChenZhe GaoWenlei YangPeter BartkovjakQing QinXiaoqin HuDahei ZhouMasayuki UchiyamaShimpei FukuokaChengcheng XuHiroaki EbiharaAndy WangPeiwen JiangBo JiangBo MuHuan ChenJason YangTJ DaiAndreas SuessYoshiharu Kudo
Published in: ISSCC (2023)
Keyphrases
  • step size
  • electric vehicles
  • low cost
  • semiconductor manufacturing
  • neural network
  • fuzzy logic
  • high speed
  • integrated circuit
  • image sensor