Sebastian Engelmann

Publication Activity (10 Years)

Years Active: 2015-2019
Publications (10 Years): 4

Top Topics

Biological Knowledge

Silicon Dioxide

Top Venues

Publications

William M. J. Green, Eric J. Zhang, Chi Xiong, Yves Martin, Jason Orcutt, Martin Glodde, Laurent Schares, Tymon Barwicz, Chu C. Teng, Nathan Marchack, Elizabeth Duch, Swetha Kamlapurkar, Sebastian Engelmann, Nigel Hinds, Tom Picunko, Russell Wilson, Gerard Wysocki
Silicon Photonic Gas Sensing. OFC (2019)
Tymon Barwicz, Swetha Kamlapurkar, Yves Martin, Robert L. Bruce, Sebastian Engelmann
A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications. OFC (2017)
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
High-throughput photonic packaging. OFC (2017)
Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski, Jean-François Morissette, Yan Thibodeau, Luc Patry, Ted W. Lichoulas, Eddie L. Kimbrell, Stephan Martel, Swetha Kamlapurkar, Sebastian Engelmann, Robert L. Bruce, Yurii A. Vlasov, Paul Fortier
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides. OFC (2016)
Tymon Barwicz, Yoichi Taira, Shotaro Takenobu, Nicolas Boyer, Alexander Janta-Polczynski, Yan Thibodeau, Swetha Kamlapurkar, Sebastian Engelmann, Hidetoshi Numata, Robert L. Bruce, Simon Laflamme, Paul Fortier, Yurii A. Vlasov
Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides. OFC (2015)
Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater, Yan Thibodeau, Robert Leidy, Jeffrey Maling, Stephan Martel, Sebastian Engelmann, Jason S. Orcutt, Paul Fortier, William M. J. Green
An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides. OFC (2015)
Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. OFC (2015)