Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability.
Tymon BarwiczYoichi TairaTed W. LichoulasNicolas BoyerHidetoshi NumataYves MartinJae-Woong NahShotaro TakenobuAlexander Janta-PolczynskiEddie L. KimbrellRobert LeidyMarwan KhaterSwetha KamlapurkarSebastian EngelmannYurii A. VlasovPaul FortierPublished in: OFC (2015)
Keyphrases
- high throughput
- assembly line
- genome wide
- microarray
- biological data
- systems biology
- assembly line balancing
- data acquisition
- protein protein interactions
- dna sequencing
- high speed
- gene expression
- beam search
- mass spectrometry
- computational complexity
- mass spectrometry data
- production line
- genomic data
- processing times
- expert systems
- real time