Alexander Janta-Polczynski

Publication Activity (10 Years)

Years Active: 2015-2020
Publications (10 Years): 3

Top Topics

Top Venues

Publications

Alexander Janta-Polczynski, Tymon Barwicz, Richard Langlois, Chao Li, Ying Wang, Guo-Qiang Lo, Shotaro Takenobu, Kenta Kobayashi, Kengo Watanabe, Dan Deptuck, Nicolas Boyer, Paul Fortier
Self-Aligned Polymeric Fiber Interface with 20/mm Port Density and 1.1 dB O-Band Loss. ECOC (2020)
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
High-throughput photonic packaging. OFC (2017)
Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski, Jean-François Morissette, Yan Thibodeau, Luc Patry, Ted W. Lichoulas, Eddie L. Kimbrell, Stephan Martel, Swetha Kamlapurkar, Sebastian Engelmann, Robert L. Bruce, Yurii A. Vlasov, Paul Fortier
A metamaterial converter centered at 1490nm for interfacing standard fibers to nanophotonic waveguides. OFC (2016)
Tymon Barwicz, Yoichi Taira, Shotaro Takenobu, Nicolas Boyer, Alexander Janta-Polczynski, Yan Thibodeau, Swetha Kamlapurkar, Sebastian Engelmann, Hidetoshi Numata, Robert L. Bruce, Simon Laflamme, Paul Fortier, Yurii A. Vlasov
Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides. OFC (2015)
Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater, Yan Thibodeau, Robert Leidy, Jeffrey Maling, Stephan Martel, Sebastian Engelmann, Jason S. Orcutt, Paul Fortier, William M. J. Green
An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides. OFC (2015)
Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. OFC (2015)