S. Chavali

Publication Activity (10 Years)

Years Active: 2013-2013
Publications (10 Years): 0

Top Topics

Simulated Annealing

Finite Element Model

Material Properties

Top Venues

Microelectron. Reliab.

Publications

S. Chavali, Y. Singh, Ganesh Subbarayan, A. Bansal, M. Ahmad
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. Microelectron. Reliab. 53 (6) (2013)