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Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys.
S. Chavali
Y. Singh
Ganesh Subbarayan
A. Bansal
M. Ahmad
Published in:
Microelectron. Reliab. (2013)
Keyphrases
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mechanical properties
finite element model
failure rate
simulated annealing
material properties
three dimensional
semiconductor devices
neural network