Robert Klengel

Publication Activity (10 Years)

Years Active: 2011-2014
Publications (10 Years): 0

Top Topics

Mechanical Properties

Thermal Conductivity

High Reliability

Top Venues

Microelectron. Reliab.

Publications

Benjamin März, Andreas Graff, Robert Klengel, Matthias Petzold
Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials. Microelectron. Reliab. 54 (9-10) (2014)
Rainer Dohle, Matthias Petzold, Robert Klengel, Holger Schulze, Frank Rudolf
Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire. Microelectron. Reliab. 51 (1) (2011)