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R. Bonda
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
High Density
Magnetic Recording
Database
Top Venues
Microelectron. Reliab.
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Publications
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J. W. Jang
,
L. Li
,
P. Bowles
,
R. Bonda
,
D. R. Frear
High-lead flip chip bump cracking on the thin organic substrate in a module package.
Microelectron. Reliab.
52 (2) (2012)