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High-lead flip chip bump cracking on the thin organic substrate in a module package.
J. W. Jang
L. Li
P. Bowles
R. Bonda
D. R. Frear
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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low cost
high speed
real time
wide range
single chip
magnetic recording
database
video sequences
high precision
high density
physical design
host computer