Mei-Ling Wu

Publication Activity (10 Years)

Years Active: 2010-2018
Publications (10 Years): 1

Top Topics

Reliability Analysis

Genetic Algorithm

Top Venues

Microelectron. Reliab.

Publications

Mei-Ling Wu, Jia-Shen Lan
Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events. Microelectron. Reliab. 80 (2018)
Mei-Ling Wu
Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue. Microelectron. Reliab. 50 (1) (2010)
Mei-Ling Wu, Donald Barker
Rapid assessment of BGA life under vibration and bending, and influence of input parameter uncertainties. Microelectron. Reliab. 50 (1) (2010)