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Jun-Hsien Yeh
Publication Activity (10 Years)
Years Active: 2014-2015
Publications (10 Years): 0
Top Topics
Wire Bonding
Risk Assessment
Fuzzy Inference System
Failure Modes
Top Venues
Microelectron. Reliab.
J. Intell. Fuzzy Syst.
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Publications
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Tsung-Nan Tsai
,
Jun-Hsien Yeh
Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system.
J. Intell. Fuzzy Syst.
28 (6) (2015)
Jun-Hsien Yeh
,
Tsung-Nan Tsai
Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method.
Microelectron. Reliab.
54 (1) (2014)