J. W. Wan

Publication Activity (10 Years)

Years Active: 2005-2008
Publications (10 Years): 0

Publications

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectron. Reliab. 48 (3) (2008)
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Recent advances in modeling the underfill process in flip-chip packaging. Microelectron. J. 38 (1) (2007)
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Influence of transient flow and solder bump resistance on underfill process. Microelectron. J. 36 (8) (2005)