D. J. Bergstrom

Publication Activity (10 Years)

Years Active: 2005-2012
Publications (10 Years): 0

Top Topics

Modeling Framework

Top Venues

IEEE Trans. Biomed. Eng.

Publications

Xin Yan, D. J. Bergstrom, X. B. Chen
Modeling of Cell Cultures in Perfusion Bioreactors. IEEE Trans. Biomed. Eng. 59 (9) (2012)
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectron. Reliab. 48 (3) (2008)
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Recent advances in modeling the underfill process in flip-chip packaging. Microelectron. J. 38 (1) (2007)
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom
Influence of transient flow and solder bump resistance on underfill process. Microelectron. J. 36 (8) (2005)